Three Patents Advancing Reliability, Thermal Management, and Modular Power Systems

GSP Battery Korea has secured three key patents that reinforce manufacturing reliability, thermal control,
and modular power architecture.

First, the nickel-terminal soldering method and dedicated jig for PCM boards standardizes solder volume,
pressure, and thermal profile to reduce operator variability, thereby minimizing contact resistance growth,
micro-cracks, and rework. This directly improves yield and consistency in mass production of high-current
terminals.

Second, the high-dissipation auxiliary power device for dashcams (KR Patent No. 10-2002348) applies optimized
heat-spreading structures and materials to limit cell and BMS temperature rise during prolonged operation,
preserving safety margins and mitigating thermal-induced degradation in automotive environments.

Third, the Double Twin Power Bank System (KR Patent No. 10-2353461) enables two battery packs to operate in
parallel or independently, supporting capacity scaling while providing redundancy for uninterrupted power. The
design elevates field deployability, scalability, and serviceability across diverse use cases.

Together, these patents form a coherent stack—process reliability → device-level thermal stability →
system-level modularity—strengthening GSP’s capability to deliver safe, predictable power across applications.